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Manufactured Products
Precision UV-Curable Adhesives
(AT4291A, AT9290F)
Features
Low shrinkage during curing (3% or less).
Low thermal expansion coefficient (2 * / or less).
Adhesion/fixation at submicron levels is possible
because displacement of bonded subjects during curing or
from temperature changes is so small.
Turns transparent when cured (AT9290F).
Easy to check the degree of curing and able to cure
large depth (AT9290F).
Fig. Thermal properties of LD modules
fabricated with precision adhesive.
Fig. Thermal expansion coefficient
and shrinkage during curing
Comparison of
a) :precision UV-curable adhesives (a=2 * /)
and
b) :general-purpose UV adhesives (a=30 * /)
a: thermal expansion coefficient
Main properties of Precision
Adhesives (AT4291A, AT9290F)
Name (Main Components)
AT4291A
(Epoxy)
AT9290F
(Epoxy)
Conditions (Viscosity)) [25]
Milky white viscous liquid (approx
27,000cP)
Milky white viscous liquid
(> 27,000 cP)
Curing
Curing Time (min)
10 *1
10 *2
Shrinkage during curing (%)
2~3
1~2
Depth of cure (mm)
~5
~8
Properties after curing
Thermal expansion coefficient ()
2
< 4
Hardness (Shore D) [25]
92
89
Glass Transition Temperature ()
209
134 ~147
Adhesion Strength
(Kgf/cm2) [Glass]
>116
> 200
(Note)
Not able to use in the optical path. This property data is a
measured value on samples instead of the guaranteed
value.
Recommended curing process :
/
or less).
:precision UV-curable adhesives (a=2 * 
:general-purpose UV adhesives (a=30 * 
)
